Job Details:

Job Description:

Leads a team of lithography development engineers to drive technology development and enablement across the full range of patterning modules for advanced CMOS technologies.

Will be responsible for development and driving manufacturability across key lithography tools including but not limited to DUV and EUV.

Primary responsibilities will reside at the intersection of technology development and high volume manufacturing especially on new lithography processes that require engineering to meet high volume requirements.

This includes driving safety, quality, performance, throughput, capability (pattern fidelity), uniformity and cost.

This organization will engage closely with lithography teams in technology development as well as the high volume lithography teams in the factories and will be part of the Manufacturing Development team.

This leader will set the goals for the team, manage the program deliverables and coach and develop the engineers while also developing an understanding of the future needs of the organization and putting in place an organizational strategy to meet the needs of Intel foundry technologies roadmap.

The leader will be a lithography subject matter expert and have experience working with Integration and other modules leaders such as etch and thin films to deliver modular solutions that meet the technology targets.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:
14 years of relevant work experience in the semiconductor space with a strong focus on lithography.
Masters Degree in Electrical Engineering or Technical Equivalent
Prior senior management with large, multi-national manufacturing employers, preferably in high technology/scientific/semiconductor sectors with prior specialization in technology development.
Strong history of industry experience in process development, leadership, and semiconductor process.
Background working with a combination of investors and third- party suppliers on solution optimization/customization to meet their manufacturing needs especially with the industry leaders in lithography solutions such as ASML and KT.
Engineering group leader background at global scale including leading significant factory ramp-up and process technology development in high volume manufacturing environments.
Extensive experience in fab start-up with technical track record in multiple areas of semi-conductor sector in areas such as manufacturing engineering, quality and reliability, research and development, sourcing/supply chain innovations etc.

Preferred Qualifications
Substantial technical background in lithography as used in advanced CMOS technologies with a body of research and patents. Demonstrated history of delivering customized solutions in Research and Development and HVM organizations. Previous related work experience in a semiconductor foundry preferred. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

US, Oregon, Hillsboro

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US:

$248,400.00-350,690.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.