Experienced IC Package Design Engineer
Mobileye, an Intel Company
Marketing & Communications, Product, Design
Petah Tikva, Israel
Posted on Apr 15, 2025
Mobileye develops high-performance imaging radar for autonomously driving vehicles. The project involves cutting-edge HW, VLSI, mechanics, SW and Algorithms. We are looking for an Experienced Chip Package Design Engineer to be part of our imaging radar HW team.
What will your job look like:
- Technical Project lead & Co Design to support the development of IC package with the OSAT, Si, VLSI and System Architecture teams.
- Manage co-design meetings with HW, RF and VLSI teams
- Design IC packages (e.g., flip-chip, wafer-level, FCBGA) using industry-standard EDA tools (e.g., Cadence APD/SIP, Mentor, Ansys tools)
- Manage subcontractors and vendors for development and manufacturing of chip substrate, IC package and IC testing
- Simulate high-performance signal/power-integrity chip substrate, including layout, mechanical & thermal simulations
- Collaborate and support peer teams from other projects
All you need is:
- B.Sc in Electrical Engineering
- 5+ years of hands-on experiences in chip package activities
- 3+ years of hands-on experience as managing chip packaging vendors
- Experience with relevant CAD tooling for chip package development & simulation for layout, mechanical & thermal simulations
- Experience with Digital High Speed, Analog and Power design
- Experience with Signal Integrity and Power Integrity simulation tools for Digital and analog using IBIS and S-Parameters models – advantage
- Familiar with Automotive industry– advantage
- Experience with RFIC design and simulation - advantage
Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!