Semiconductor Package and Assembly Designer
Mobileye, an Intel Company
Marketing & Communications, Product, Design
Petah Tikva, Israel
Posted on Jul 30, 2025
Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products.
You’ll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
- Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
- Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
- Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
- Collaborate with OSATs to define and validate assembly materials and process flows.
- Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
- Monitor yield, quality, and manufacturability across package development and production stages.
- Support DFM reviews and ensure compliance with automotive standards and customer requirements
All you need is:
- B.Sc. or M.Sc. in Electrical Engineering, Materials Science, or a related field.
- 3+ years of experience in semiconductor package design and assembly.
- Deep knowledge of package design, substrate engineering, and simulation methodologies.
- Hands-on experience with package layout tools such as Cadence Allegro Package Designer or Xpedition Package Designer.
- Solid understanding of high-speed layout constraints (e.g., crosstalk, EMI, RFI) and proven experience with interfaces like DDR, PCIe, MIPI, and UFS.
- Strong background in schematic review, capture, and system-level integration.
- Proficiency in scripting for automation and design optimization with tools like MATLAB or Python – advantage.
- Proficiency in layout design verification tool such as CAM350- advantage.
- Experience working directly with OSATs
- Proven experience with SIPI simulation tools like Ansys SIwave, Ansys HFSS, Cadence Sigrity and Siemens HyperLynx – advantage.
- Proven experience with thermal or thermo-mechanical simulation tools like Cadence Celsius, Ansys Icepak, Ansys Mechanical and Flotherm - advantage.