Semiconductor Quality and Reliability Engineer
Mobileye, an Intel Company
Quality Assurance
Jerusalem, Israel
Posted on Jul 30, 2025
As a Quality and Reliability (Q&R) Engineer, you will lead the qualification and long-term reliability of advanced System-on-Chip (SoC) semiconductor products for automotive applications. You’ll work across digital and RF domains to ensure robust performance and compliance with industry standards.
What will your job look like:
- Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC die and package.
- Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
- Design and implement die-level and package-level stress tests.
- Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
- Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
- Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
- Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
- Document and certify automotive standards compliance, including PPAP/APQP deliverables.
All you need is:
- BSc/MSc in Electrical Engineering, Physics, or related field.
- 5+ years of experience in semiconductor Q&R, preferably with SoCs, ASICs, VLSI, or RF ICs.
- Strong knowledge of semiconductor physics, packaging technologies, materials and reliability mechanisms.
- Hands-on experience with Q&R test design and environmental stress testing.
- Deep understanding of failure prediction models, reliability simulations, and statistical analysis.
- High proficiency in English, including strong verbal, reading, and writing skills.
- Familiarity with RF reliability concerns – advantage.
- Expertise in automotive Q&R standards, including AEC-Q100, IATF 16949, and JEDEC/ISO/IEEE protocols -advantage.
- Experience with advanced packaging Q&R (e.g., WLCSP, FCBGA) -advantage.
- Exposure to radar or ADAS/AV automotive systems Q&R – advantage.