FA Engineer with X-Ray -Inspection Expertise
Mobileye, an Intel Company
Haifa, Israel
Posted on Aug 7, 2025
Mobileye is seeking a skilled Failure Analysis (FA) Engineer with expertise in X-ray inspection techniques to join our AV Platform team. The ideal candidate will specialize in using advanced X-ray imaging and other analysis methods to investigate product failures, identify root causes, and provide actionable insights to improve product quality and reliability
What will your job look like?
- Perform detailed failure analysis using X-ray imaging systems and related diagnostic tools to inspect electronic components, assemblies, and materials.
- Interpret and analyze X-ray images to detect structural anomalies, defects, voids, cracks, delamination, and other failure mechanisms.
- Develop and optimize X-ray inspection procedures and protocols for failure analysis and quality control.
- Prepare test specimens: cutting, mounting, grinding, polishing and chemical etching
- Collaborate with product engineering, quality assurance, and manufacturing teams to support product development, troubleshooting, and continuous improvement efforts.
- Prepare detailed technical reports documenting findings, root cause analyses, and recommended corrective actions.
- Support reliability testing and failure mode analysis for new and existing products.
All you need is:
- Bachelor’s or Master’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field.
- Proven experience in failure analysis with a strong focus on X-ray imaging and inspection.
- Proficiency in operating and interpreting data from X-ray inspection systems (e.g., 2D/3D X-ray CT).
- Strong analytical and problem-solving skills with attention to detail.
- Familiarity with semiconductor, electronics, or other relevant industry standards.
- Excellent communication skills for reporting technical findings clearly and effectively.
- Ability to work independently and as part of a cross-functional team.
- Experience with complementary failure analysis tools e.g., SEM, FIB and optical microscopy